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µS-P1 Prototyping Board User Manual

Introduction

The µS-P1 prototyping board allows you to quickly and easily construct any custom electronics needed for your µStack project. All µStack signals and power are routed to a convenient distribution header for easy access, each connection is labelled on the board for instant identification. The prototype board is high quality PCB with plated through holes throughout. The top of the board is laid out as a "colander" ground plane making the µS-P1 suitable for high speed/low noise applications.

 

The prototyping area consists of a grid of standard 0.1" pitch holes divided into three segments. The 5V and Gnd rails run vertically down the centre of each segment allowing convenient power distribution to ICs. Holes on each side of the power rails are linked horizontally for ease of signal distribution.

 

Segment 1 and 2 are suitable for the narrow 0.3" pitch DIL packages, segment 3 can also accommodate the wider 0.6" pitch DIL packages. All segments are suitable for passive components.

 

Making the connection

While the µS-P1 can be used in many ways, it has been specifically designed to use a "top of board" wire-wrap technique. When this technique is used there is sufficient vertical clearance for multiple prototype boards in a stack. Connections are made on the top of the board between soldered in square pin headers using a standard wrapping tool. Each header pin can accommodate up to two wrap connections.

 

Mounting IC's

The most convenient mounting position for an IC is straddling the power rails. ICs should where possible be socketed. Because of the horizontal connections on each side of the power rails, you can now get access to the IC pins via the holes on each side of the chip. To use the suggested wire-wrap technique you should solder a row of square pin headers on each side of the IC, you can now make any required connections to the IC using a wire-wrap tool.

 

Mounting Axial Components

Axial components such as resistors and capacitors can be soldered directly into the board across the power rails. As with ICs, a square pin header soldered in adjacent to the component will allow easy wire-wrap connection to other components on the board.

 

 

 

Mounting Connectors

The huge variety of signal connectors available make it unfeasible to lay out a prototype board to facilitate them all. However with a little ingenuity most types of connectors can be accommodated. Many connectors have a standard 0.1" pitch configuration and so can be mounted directly onto the prototyping area. In particular the area to the right of the main prototype grid is suitable for many connectors such as the popular Molex KK series or similar (as used as the power connector on the µFlash SBC, µS-BS2 µS-DD4).

Connectors with unusual pin layouts (such as D-type communications, Mini-DIN interface, RJ45 and RJ11 telecom) can be glued upside-down to the prototype board, wire-wrap connection can then be made directly to the pins of the connector. This is also the best way to make a connection to a standard IDC "ribbon cable" connector. Note that when using this technique, "Right Angle" versions of the connector should be chosen so that the pins point vertically when the connector is glued to the board.

 

 

 

 

 

Careful selection of connectors can make life easier when using the "glue to board" technique. The flat area on the D-type connector to the right will allow it to be securely glued to the board, the similar connector to the left would be much more difficult to attach.

 

 

Not just for interface boards, - an early prototype of the µFlash SBC constructed on a µS-P1, note the D-type connector for the RS232 interface glued upside-down to the board.

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